Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)
STANDARD published on 1.6.2011
Designation standards: ČSN EN 60191-6-21
Classification mark: 358791
Catalog number: 88328
Publication date standards: 1.6.2011
The number of pages: 40
Approximate weight : 120 g (0.26 lbs)
Country: Czech technical standard
Category: Technical standards ČSN