Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
STANDARD published on 1.1.2004
Designation standards: ČSN EN 60191-6-4
Classification mark: 358791
Catalog number: 69427
Publication date standards: 1.1.2004
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: Czech technical standard
Category: Technical standards ČSN