ČSN EN IEC 61189-3-302 (359039)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

STANDARD published on 1.5.2026

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The information about the standard:

Designation standards: ČSN EN IEC 61189-3-302
Classification mark: 359039
Catalog number: 523336
Publication date standards: 1.5.2026
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: Czech technical standard
Category: Technical standards ČSN

Annotation of standard text ČSN EN IEC 61189-3-302 (359039):

This part of IEC 61189 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes