Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
STANDARD published on 1.3.2022
Designation standards: ČSN EN IEC 61189-2-807
Classification mark: 359039
Catalog number: 513935
Publication date standards: 1.3.2022
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA)