Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity
STANDARD published on 1.1.2022
Designation standards: ČSN EN IEC 62878-2-602
Classification mark: 359378
Catalog number: 513471
Publication date standards: 1.1.2022
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
High-end servers, network systems and smart phones have been driving the electronic assembly technologies for the last couple of decades. Any applications to enable the "Internet of Things" (aka IoT) require new electronic assembly technologies to achieve small size, low energy consumption and robust security in a cost-effective way. This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules