Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
STANDARD published on 1.1.1996
Designation standards: ČSN IEC 249-3-1
Classification mark: 359053
Catalog number: 18572
Note: WITHDRAWN
Publication date standards: 1.1.1996
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: Czech technical standard
Category: Technical standards ČSN