
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation.
STANDARD published on 1.6.2024
Designation standards: DIN 50003:2024-06
Publication date standards: 1.6.2024
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: German technical standard
Category: Technical standards DIN
Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung.