DIN EN 60749-15:2003-10

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices.

STANDARD published on 1.10.2003

The information about the standard:

Designation standards: DIN EN 60749-15:2003-10
Note: WITHDRAWN
Publication date standards: 1.10.2003
The number of pages: 8
Approximate weight : 24 g (0.05 lbs)
Country: German technical standard
Category: Technical standards DIN