
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability.
STANDARD published on 1.6.2005
Designation standards: DIN EN 60749-21:2005-06
Note: WITHDRAWN
Publication date standards: 1.6.2005
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit.