DIN EN 61190-1-2:2003-01

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly.

STANDARD published on 1.1.2003

The information about the standard:

Designation standards: DIN EN 61190-1-2:2003-01
Note: WITHDRAWN
Publication date standards: 1.1.2003
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN