DIN EN 61190-1-2:2014-11

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly.

STANDARD published on 1.11.2014

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The information about the standard:

Designation standards: DIN EN 61190-1-2:2014-11
Publication date standards: 1.11.2014
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 61190-1-2:2014-11 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage.