DIN EN 61190-1-3:2003-01

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.

STANDARD published on 1.1.2003

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The information about the standard:

Designation standards: DIN EN 61190-1-3:2003-01
Note: WITHDRAWN
Publication date standards: 1.1.2003
The number of pages: 36
Approximate weight : 108 g (0.24 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 61190-1-3:2003-01 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten.