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DIN EN 61191-3:2018-05

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies.

STANDARD published on 1.5.2018

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The information about the standard:

Designation standards: DIN EN 61191-3:2018-05
Publication date standards: 1.5.2018
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 61191-3:2018-05 :

Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage.