Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies.
STANDARD published on 1.5.2018
Designation standards: DIN EN 61191-3:2018-05
Publication date standards: 1.5.2018
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: German technical standard
Category: Technical standards DIN
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage.