
Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies.
STANDARD published on 1.6.1999
    
        Designation standards: DIN EN 61191-3:1999-06
                
                
                
                Note:    WITHDRAWN
               
                Publication date standards:  1.6.1999
        The number of pages: 13
Approximate weight : 39 g (0.09 lbs)
        Country:          German technical standard
        Category: Technical standards DIN
        
                
              
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation: Anforderungen an gelötete Baugruppen in Durchsteckmontage.