
Semiconductor devices - Metallization stress void test.
STANDARD published on 1.12.2010
    
        Designation standards: DIN EN 62418:2010-12
                
                
                
               
                Publication date standards:  1.12.2010
        The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
        Country:          German technical standard
        Category: Technical standards DIN
        
                
              
Halbleiterbauelemente - Prüfverfahren zur Metallisierungs-Stressmigration.