DIN EN 60191-6-20:2011-03

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ).

STANDARD published on 1.3.2011

The information about the standard:

Designation standards: DIN EN 60191-6-20:2011-03
Publication date standards: 1.3.2011
The number of pages: 14
Approximate weight : 42 g (0.09 lbs)
Country: German technical standard
Category: Technical standards DIN