DIN EN 60191-6-5:2002-05

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA).

STANDARD published on 1.5.2002

The information about the standard:

Designation standards: DIN EN 60191-6-5:2002-05
Publication date standards: 1.5.2002
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: German technical standard
Category: Technical standards DIN