DIN EN 60749-14:2004-07

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity).

STANDARD published on 1.7.2004

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The information about the standard:

Designation standards: DIN EN 60749-14:2004-07
Publication date standards: 1.7.2004
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 60749-14:2004-07 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse).