DIN EN 60749-20-1:2009-10

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat.

STANDARD published on 1.10.2009

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The information about the standard:

Designation standards: DIN EN 60749-20-1:2009-10
Publication date standards: 1.10.2009
The number of pages: 39
Approximate weight : 117 g (0.26 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 60749-20-1:2009-10 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind.