Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability.
STANDARD published on 1.1.2012
Designation standards: DIN EN 60749-21:2012-01
Publication date standards: 1.1.2012
The number of pages: 23
Approximate weight : 69 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit.