DIN EN 60749-22:2003-12

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength.

STANDARD published on 1.12.2003

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The information about the standard:

Designation standards: DIN EN 60749-22:2003-12
Publication date standards: 1.12.2003
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 60749-22:2003-12 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit (Bond-Strength).