Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing.
STANDARD published on 1.12.2003
Designation standards: DIN EN 60749-8:2003-12
Publication date standards: 1.12.2003
The number of pages: 16
Approximate weight : 48 g (0.11 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 8: Dichtheit.