DIN EN 62047-13:2012-10

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures.

STANDARD published on 1.10.2012

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The information about the standard:

Designation standards: DIN EN 62047-13:2012-10
Publication date standards: 1.10.2012
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 62047-13:2012-10 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen.