Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods.
STANDARD published on 1.12.2015
Designation standards: DIN EN 62047-16:2015-12
Publication date standards: 1.12.2015
The number of pages: 13
Approximate weight : 39 g (0.09 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 16: Messverfahren zur Ermittlung der Eigenspannungen in Dünnschichten von MEMS-Bauteilen - Substratkrümmungs- und Biegebalken-Verfahren.