NORMSERVIS s.r.o.

DIN EN 62047-18:2014-04

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials.

STANDARD published on 1.4.2014

German -
PDF - Immediate download (92.70 USD)

German -
Print design (112.30 USD)

German -
CD-ROM (94.30 USD)

The information about the standard:

Designation standards: DIN EN 62047-18:2014-04
Publication date standards: 1.4.2014
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 62047-18:2014-04 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe.