DIN EN 62047-25:2017-04

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area.

STANDARD published on 1.4.2017

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The information about the standard:

Designation standards: DIN EN 62047-25:2017-04
Publication date standards: 1.4.2017
The number of pages: 23
Approximate weight : 69 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 62047-25:2017-04 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 25: Siliziumbasierte MEMS-Herstellungstechnologie - Messverfahren zur Zug-Druck- und Scherfestigkeit gebondeter Flächen im Mikrometerbereich.