DIN EN 62047-9:2012-03

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS.

STANDARD published on 1.3.2012

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The information about the standard:

Designation standards: DIN EN 62047-9:2012-03
Publication date standards: 1.3.2012
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 62047-9:2012-03 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 9: Prüfverfahren zur Festigkeit von Full-Wafer-Bondverbindungen in der Mikrosystemtechnik (MEMS).