Semiconductor devices - Metallization stress void test.
STANDARD published on 1.12.2010
Designation standards: DIN EN 62418:2010-12
Publication date standards: 1.12.2010
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Prüfverfahren zur Metallisierungs-Stressmigration.