DIN EN IEC 60749-15:2022-05

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices.

STANDARD published on 1.5.2022

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The information about the standard:

Designation standards: DIN EN IEC 60749-15:2022-05
Publication date standards: 1.5.2022
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN IEC 60749-15:2022-05 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage.