DIN EN IEC 60749-30:2023-02

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing.

STANDARD published on 1.2.2023

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The information about the standard:

Designation standards: DIN EN IEC 60749-30:2023-02
Publication date standards: 1.2.2023
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN IEC 60749-30:2023-02 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen.