Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT).
STANDARD published on 1.8.2026
Designation standards: DIN EN IEC 61189-3-302:2026-08
Note: WITHDRAWN
Publication date standards: 1.8.2026
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Computertomographisches Verfahren (CT) zur Detektion von Metallisierungsfehlern in unbestückten Leiterplatten.