DIN EN IEC 62878-2-603:2026-03

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity.

STANDARD published on 1.3.2026

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The information about the standard:

Designation standards: DIN EN IEC 62878-2-603:2026-03
Publication date standards: 1.3.2026
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN IEC 62878-2-603:2026-03 :

Montageverfahren für eingebettete Bauteile - Teil 2-603: Leitfaden für gestapelte Elektronikmodule - Prüfverfahren für die elektrische Konnektivität innerhalb des Moduls.