
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989.
STANDARD published on 1.4.1992
Designation standards: DIN IEC 60068-2-58:1992-04
Note: WITHDRAWN
Publication date standards: 1.4.1992
The number of pages: 8
Approximate weight : 24 g (0.05 lbs)
Country: German technical standard
Category: Technical standards DIN
Elektrotechnik; Umweltprüfungen; Prüfung Td: Lötbarkeit, Ablegierfestigkeit und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelementen (SMD).