
Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method.
STANDARD published on 1.5.2002
Designation standards: E DIN EN 60191-6-4:2002-05
Note: WITHDRAWN
Publication date standards: 1.5.2002
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: German technical standard
Category: Technical standards DIN
Mechanische Normung von Halbleiterbauelementen - Teil 6-4: Messverfahren für BGA-Gehäuse.