E DIN EN 60749-14:2002-09

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity).

STANDARD published on 1.9.2002

English and German -
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The information about the standard:

Designation standards: E DIN EN 60749-14:2002-09
Note: WITHDRAWN
Publication date standards: 1.9.2002
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 60749-14:2002-09 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Anschlüsse (Unversehrtheit der Anschlüsse).