E DIN EN 60749-15:2009-06

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices.

STANDARD published on 1.6.2009

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The information about the standard:

Designation standards: E DIN EN 60749-15:2009-06
Note: WITHDRAWN
Publication date standards: 1.6.2009
The number of pages: 13
Approximate weight : 39 g (0.09 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 60749-15:2009-06 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage.