E DIN EN 60749-19:2002-05

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test.

STANDARD published on 1.5.2002

English and German -
electronic design (pdf) (48.90 USD)

The information about the standard:

Designation standards: E DIN EN 60749-19:2002-05
Note: WITHDRAWN
Publication date standards: 1.5.2002
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 60749-19:2002-05 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit.