E DIN EN 61190-1-2/A1:2012-03

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly.

STANDARD published on 1.3.2012

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The information about the standard:

Designation standards: E DIN EN 61190-1-2/A1:2012-03
Note: WITHDRAWN
Publication date standards: 1.3.2012
The number of pages: 23
Approximate weight : 69 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 61190-1-2/A1:2012-03 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage.