E DIN EN 61191-3:2016-01

Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies.

STANDARD published on 1.1.2016

English and German -
electronic design (pdf) (117.80 USD)

The information about the standard:

Designation standards: E DIN EN 61191-3:2016-01
Note: WITHDRAWN
Publication date standards: 1.1.2016
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 61191-3:2016-01 :

Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage.