E DIN EN 62047-18:2011-06

Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials.

STANDARD published on 1.6.2011

The information about the standard:

Designation standards: E DIN EN 62047-18:2011-06
Note: WITHDRAWN
Publication date standards: 1.6.2011
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN