E DIN EN 62047-27:2015-08

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT).

STANDARD published on 1.8.2015

English and German -
electronic design (pdf) (103.70 USD)

English and German -

Print design (129.20 USD)

The information about the standard:

Designation standards: E DIN EN 62047-27:2015-08
Note: WITHDRAWN
Publication date standards: 1.8.2015
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 62047-27:2015-08 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 27: Prüfung der Bondfestigkeit von Glasfritt gebondeten Strukturen unter Verwendung des Mikro-Chevron-Tests (MCT).