E DIN EN 62137-4:2013-01

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices.

STANDARD published on 1.1.2013

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The information about the standard:

Designation standards: E DIN EN 62137-4:2013-01
Note: WITHDRAWN
Publication date standards: 1.1.2013
The number of pages: 73
Approximate weight : 219 g (0.48 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 62137-4:2013-01 :

Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens)dauerprüfungen für Lötverbindungen.