E DIN EN IEC 60749-10:2023-06

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly.

STANDARD published on 1.6.2023

German -
electronic design (pdf) (99.10 USD)

The information about the standard:

Designation standards: E DIN EN IEC 60749-10:2023-06
Note: WITHDRAWN
Publication date standards: 1.6.2023
The number of pages: 13
Approximate weight : 39 g (0.09 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN IEC 60749-10:2023-06 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10: Mechanischer Schock - Bauelemente und Unterbaugruppe.