E DIN EN IEC 60749-22-1:2026-11

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods.

STANDARD published on 1.11.2026

The information about the standard:

Designation standards: E DIN EN IEC 60749-22-1:2026-11
Publication date standards: 1.11.2026
The number of pages: 64
Approximate weight : 192 g (0.42 lbs)
Country: German technical standard
Category: Technical standards DIN