E DIN EN IEC 60749-22-2:2026-11

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods.

STANDARD published on 1.11.2026

The information about the standard:

Designation standards: E DIN EN IEC 60749-22-2:2026-11
Publication date standards: 1.11.2026
The number of pages: 37
Approximate weight : 111 g (0.24 lbs)
Country: German technical standard
Category: Technical standards DIN