E DIN EN IEC 60749-37:2023-02

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer.

STANDARD published on 1.2.2023

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The information about the standard:

Designation standards: E DIN EN IEC 60749-37:2023-02
Note: WITHDRAWN
Publication date standards: 1.2.2023
The number of pages: 42
Approximate weight : 126 g (0.28 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN IEC 60749-37:2023-02 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes.