E DIN EN IEC 61189-3-302:2025-11

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT).

STANDARD published on 1.11.2025

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The information about the standard:

Designation standards: E DIN EN IEC 61189-3-302:2025-11
Publication date standards: 1.11.2025
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN IEC 61189-3-302:2025-11 :

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Erkennung von Beschichtungsfehlern in unbestückten Leiterplatten durch Computertomographie (CT).