E DIN EN IEC 62878-2-603:2023-07

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity.

STANDARD published on 1.7.2023

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The information about the standard:

Designation standards: E DIN EN IEC 62878-2-603:2023-07
Note: WITHDRAWN
Publication date standards: 1.7.2023
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN IEC 62878-2-603:2023-07 :

Technologie zur Einbettung von Bauelementen - Teil 2-603: Leitfaden für gestapelte elektronische Module - Prüfverfahren für die elektrische Konnektivität innerhalb des Moduls.