E DIN EN IEC 63378-3:2026-08

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis.

STANDARD published on 1.8.2026

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The information about the standard:

Designation standards: E DIN EN IEC 63378-3:2026-08
Publication date standards: 1.8.2026
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN IEC 63378-3:2026-08 :

Thermische Standardisierung von Halbleitergehäusen - Teil 3: Thermische Schaltungssimulationsmodelle von diskreten Halbleitergehäusen für die Transientenanalyse.