E DIN EN IEC 61760-3:2019-12

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering.

STANDARD published on 1.12.2019

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The information about the standard:

Designation standards: E DIN EN IEC 61760-3:2019-12
Note: WITHDRAWN
Publication date standards: 1.12.2019
The number of pages: 65
Approximate weight : 195 g (0.43 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN IEC 61760-3:2019-12 :

Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR).